2012 Edition

national industry 334412

Bare Printed Circuit Board Manufacturing

Overview

This U.S. industry comprises establishments primarily engaged in manufacturing bare (i.e., rigid or flexible) printed circuit boards without mounted electronic components. These establishments print, perforate, plate, screen, etch, or photoprint interconnecting pathways for electric current on laminates.

The immediate parent of national industry 334412 is international industry 33441: Semiconductor and Other Electronic Component Manufacturing

2012 NAICS Edition Cross References

  • Establishments primarily engaged in:
  • Loading components onto printed circuit boards, or whose output is loaded printed circuit boards:are classified in U.S. Industry 334418, Printed Circuit Assembly (Electronic Assembly) Manufacturing; and
  • Manufacturing printed circuit laminates:are classified in U.S. Industry 334419, Other Electronic Component Manufacturing.

History

The NAICS editions in which this code was present are indicated below. In the event that a code was changed from the prior edition the equivalent value in that edition is provided for reference.

Edition Value
2002 334412 -
2007 334412 -
2012 334412 -
2017 334412 -

Standard Industrial Classification (SIC) Mappings

  1. 3672 - Printed Circuit Boards

Insurance Industry Mappings

The US Property and Casualty Insurance Industry may use the following classification descriptions which might encompass national industry 334412, Bare Printed Circuit Board Manufacturing:

  1. bare printed circuit board manufacturing
  2. computer and electronic product manufacturing
  3. electronic component and semi conductor
  4. electronic component manufacturing
  5. electronic component manufacturing insd design prod not critical part of aircraft or military related equipment
  6. electronic element manufacturing
  7. electronic element manufacturing ca
  8. electronic element manufacturing not otherwise classified
  9. manufacturing
  10. printed circuit board
  11. printed circuit board manufacturing
  12. printed circuit board manufacturing ca de pa
  13. semi conductor and electronic component
  14. semiconductor and other electronic component manufacturing

Downloads

What's the difference between HD and SD? See our methodology.